Film-forming apparatus and film-forming method
US8168001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2003 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Aug 13, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45519
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Film-forming apparatus including a film-forming vacuum chamber having a stage for a substrate, a chamber for mixing gas comprising a raw gas and a reactive gas connected to the film-forming chamber, a chamber for vaporizing the raw material, and a gas head for introducing the mixed gas into the film-forming chamber, disposed on the upper face of the film-forming chamber and opposed to the stage. Particle traps with controllable temperatures are positioned between the vaporization chamber and the mixing chamber and on the downstream side of the mixing chamber. When forming a thin film with the apparatus, a reactive gas and/or a carrier gas are passed through the film-forming chamber while opening a valve in a by-pass line, connecting the primary side to the secondary side of the particle trap arranged at the downstream side of the mixing chamber. The valve is then closed and the film-forming operation is initiated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.