Charged particle beam masking for laser ablation micromachining
US8168961B2 · kind B2 · utility
13Cited by
16References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2008 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Dec 2, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.