Patent · US Active

On-chip RF shields with through substrate conductors

US8169059B2 · kind B2 · utility

29Cited by

28References

42Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Hans-Joachim Barth · Munich, DE
Jens Pohl · San Luis Obispo, US
Gottfried Beer · Nittendorf, DE
Oliver Nagy · Wien, AT

Key dates

Filing date	Sep 30, 2008
Grant date	May 1, 2012
Priority date	—
Expiry date	Feb 11, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, the system on a chip includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary. The system on chip further includes through substrate conductors disposed in the substrate, the through substrate conductors coupled to a ground potential node, the through substrate conductors disposed around the RF component forming a fence around the RF circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.