Circuit module
US8169784B2 · kind B2 · utility
13Cited by
44References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 26, 2008 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Mar 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.