Method for the fabrication of a transistor gate using at least one electron beam
US8173545B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | May 3, 2007 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Aug 31, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32051
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A microelectronic method for the fabrication of a transistor gate using a precursor material that is suitable for being broken down into at least one metallic material after having been exposed to an electron beam. The invention applies in particular to the fabrication of multi-channel transistors, of the FinFET, suspended-channel, ITS or GAA type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.