Bonded structures formed by plasma enhanced bonding
US8174094B2 · kind B2 · utility
0Cited by
14References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 21, 2009 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Nov 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding the second surface of the substrate and the second surface of the substrate carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.