Methods of fabricating robust integrated heat spreader designs and structures formed thereby
US8174113B2 · kind B2 · utility
1Cited by
8References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 17, 2008 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Jul 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.