Polishing pad composition
US8177603B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 28, 2009 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Sep 25, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/736
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Polishing pads for use in chemical mechanical planarization (CMP) or polishing elements/surfaces of such pads are made from a combination of immiscible polymers, for example polyurethane and polyolefin. The polymers are selected on the basis of interfacial interaction, melt index and ratios of melt indices between the polymer phases—a matrix phase and a dispersed phase. By selecting the polymer system such that the two polymers are immiscible in one another and preferentially form separate domains, the dispersed phase can be removed when conditioning or polishing processes expose it. The melt index of individual polymers and the ratio of melt indices determines dispersability of a smaller phase into the matrix, hence the phase size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.