Method for manufacturing RF powder
US8178415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2007 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Jul 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q7/005
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing RF powder wherein the RF powder is composed of a large amount of particles and used as collective RF powder (a powdery entity); and a large amount of RF powder particles can be obtained from a wafer in a stable manner and at a high yield is provided.The method for manufacturing RF powder is a method for manufacturing RF powder composed of a large amount of particles 11a each having a substrate 12 and a magnetic coupling circuit device 15. This method includes a step S11 of forming many antenna circuit devices 39 on a wafer 40; a gas dicing step S13 for drawing dicing grooves on a wafer to locate positions of separation of magnetic coupling circuit devices; a protection film formation step S14 for coating surrounding areas of the magnetic coupling circuit devices with a protection film; a reinforcement step S15 for attaching the wafer to a supporting plate using an adhesive sheet; a grinding step S16 for grinding the backside of the wafer until the dicing grooves are reached; and a separation step S17 for separating the circuit devices by removing the supporting plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.