Cleaning compositions for microelectronic substrates
US8178482B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2005 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Feb 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02071
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A stripping and cleaning composition for cleaning microelectronics substrates, the composition comprising: at least one organic stripping solvent, at least one nucleophilic amine, at least one non-nitrogen containing weak acid in an amount sufficient to neutralize from about 3% to about 75% by weight of the nucleophilic amine such that the stripping composition has an aqueous pH of from about 9.6 to about 10.9, said weak acid having a pK value in aqueous solution of 2.0 or greater and an equivalent weight of less than 140, at least one metal-removing compound selected from the group consisting of diethylene glycol and diethylene glycolamine, and water, and method for cleaning microelectronic substrates with these compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.