Method and apparatus for flattening solid surface
US8178857B2 · kind B2 · utility
2Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2006 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Apr 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for flattening a sample surface by irradiating the sample surface with a gas cluster ion beam, generates clusters of source gas in a cluster generating chamber, ionizes the generated clusters in an ionization chamber, accelerates the ionized cluster beam in an electric field of an accelerating electrode, selects a cluster size using a magnetic field of a sorting mechanism, and irradiates the surface of a sample. An irradiation angle between the sample surface and the gas cluster ion beam is less than 30° and an average cluster size of the gas cluster ion beam is 50 or above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.