Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components
US8179225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2009 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Sep 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.