Semiconductor memory device with stacked memory cell and method of manufacturing the stacked memory cell
US8179711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2008 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Nov 15, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2213/79
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the resistive-change memory cells of each of the resistive-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.