Method of manufacturing a printed circuit board
US8181339B2 · kind B2 · utility
1Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2008 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Jan 31, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include forming a first protective layer over one surface of a core substrate, forming a first circuit pattern over the other surface of the core substrate by a first process, removing the first protective layer, forming a second protective layer over the other surface of the core substrate, and forming a second circuit pattern over the one surface of the core substrate by a second process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.