Ultrasonic stress measurement method and device
US8181524B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2009 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Dec 7, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/044
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to an ultrasonic stress measurement method of measuring a residual stress of a measuring target layer in a measuring object using an ultrasonic wave, the method comprising, setting a plurality of vibration modes according to a number of degree of freedom of the measuring target layer in the measuring object, performing, for each vibration mode, a measurement operation of emitting an ultrasonic wave corresponding to the set vibration mode to the measuring target layer, receiving the ultrasonic wave reflected by the measuring target layer, and measuring an eigenfrequency of the measuring target layer, and measuring the residual stress of the measuring target layer based on plural measurement data of the eigenfrequency with respect to each vibration mode obtained by the measurement operation. The residual stress of the measuring object thus can be measured at higher accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.