Method and apparatus for pass/fail determination of bonding and bonding apparatus
US8181527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2011 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Jan 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for pass/fail determination of bonding used in a bonding apparatus, includes: an ultrasonic horn configured to vibrate longitudinally in resonance with the vibration of an ultrasonic vibrator; a capillary attached at an anti-node of the vibration of the ultrasonic horn; a flange provided at a node of the vibration of the ultrasonic horn; a bonding arm; and a load sensor attached between the center of rotation of the bonding arm and a flange mounting surface in an offset manner from a longitudinal central axis of the ultrasonic horn, in which a load on the capillary in the direction toward and away from the bonding target is continuously detected by using the load sensor during bonding operation and the maximum value of the detected load is defined as an impact load to determine pass/fail of the bonding based on the impact load, thereby allowing a mid-bonding pass/fail determination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.