Substrate for inkjet printing head and method for manufacturing the substrate
US8182072B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2008 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Oct 29, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/18
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There is provided a substrate for an inkjet printing head and a method for manufacturing the same, in which the substrate has a structure that different kinds of metals do not come into contact with ink or moisture. For this purpose, the structure is constituted such that a diffusion preventing layer for mainly protecting a lower layer among power wiring metals is covered by a metal layer for mainly supplying power, in connection with its upper surface and at least part of a side surface. Herewith, since a single metal appears on a surface of the power wiring including up to its side surface, even circumstance occurs of coming into contact with the ink or the moisture, a battery reaction accompanied by difference of ionization tendency is not generated, and thus corrosion or short-circuit of the power wiring is suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.