CMP system with wireless endpoint detection system
US8182312B2 · kind B2 · utility
1Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2008 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Jan 9, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/205
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A CMP polishing pad with an optical sensor assembly embedded in the pad, connected to a transceiver and/or power supply mounted at the center of the pad or at the outer edge of the pad which communicates wirelessly with a control system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.