Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom
US8183151B2 · kind B2 · utility
285Cited by
10References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 4, 2007 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Mar 31, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming conductive elements on and in a substrate include forming a layer of conductive material over a surface of a substrate prior to forming a plurality of vias through the substrate from an opposing surface of the substrate to the layer of conductive material. In some embodiments, a temporary carrier may be secured to the layer of conductive material on a side thereof opposite the substrate prior to forming the vias. Structures, including workpieces formed using such methods, are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.