Methods of packaging a semiconductor die and package formed by the methods
US8183682B2 · kind B2 · utility
36Cited by
4References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2006 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Feb 24, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of packaging a semiconductor die. The method comprises mounting a semiconductor die to a die attach pad on a carrier and electrically coupling an electrode of the semiconductor die and a contact pad on the carrier with a clip carried by a sacrificial substrate. The method further comprises removing the sacrificial substrate to release the clip. The method may be extended to accommodate a carrier having multiple device regions each with a die attach pad and a contact pad for mounting multiple semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.