Method of producing substrate
US8186052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Oct 9, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.