Circuit board and method of manufacturing the same
US8186053B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 14, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Nov 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12035
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as strength and thermal expansion coefficient. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs formed by disposing carbon fibers so as to produce openings at positions where plated through holes will pass through and impregnating the carbon fibers with resin; a step of forming through holes that pass inside the openings at positions of the openings in the core portion; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the carbon fibers and thereby produce a core substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.