Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method
US8192578B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2006 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | May 1, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1994
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.