Spin-on protective coatings for wet-etch processing of microelectronic substrates
US8192642B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2007 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Apr 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.