Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same
US8193023B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 8, 2010 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Dec 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/933
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A unit pixel of an image sensor having a three-dimensional structure includes a first chip and a second chip which are stacked, one of the first chip and the second chip having a photodiode, and the other of the first chip and the second chip having a circuit for receiving information from the photodiode and outputting received information. The first chip includes a first pad which is projectedly disposed on an upper surface of the first chip in such a way as to define a concavo-convex structure, and the second chip includes a second pad which is depressedly disposed on an upper surface of the second chip in such a way as to define a concavo-convex structure corresponding to the concavo-convex structure of the first chip. The first chip and the second chip are mated with each other through bonding of the first pad and the second pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.