Heui-Gyun Ahn
15Patents
4h-index
11Co-inventors
53Inventor score
Filing activity: Dec 30, 2004 → Nov 27, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9613881B2 | Semiconductor device having improved heat-dissipation characteristics | Electricity | 11 | Active |
| US8193023B2 | Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same | Electricity | 8 | Active |
| US8421134B2 | Back side illumination image sensor reduced in size and method for manufacturing the same | Electricity | 7 | Active |
| US9406652B2 | Stack memory | Electricity | 4 | Active |
| US8420429B2 | Back side illumination image sensor reduced in size and method for manufacturing the same | Electricity | 1 | Active |
| US10165169B2 | Image processing package and camera module having same | Electricity | 1 | Active |
| US8399282B2 | Method for forming pad in wafer with three-dimensional stacking structure | Electricity | 1 | Active |
| US9478464B2 | Method for manufacturing through-hole silicon via | Electricity | 0 | Active |
| US8368158B2 | Image sensor having wave guide and method for manufacturing the same | Electricity | 0 | Active |
| US7772666B2 | CMOS image sensor and method for manufacturing the same | Electricity | 0 | Active |
| US8816459B2 | Image sensor having wave guide and method for manufacturing the same | Electricity | 0 | Active |
| US8993411B2 | Method for forming pad in wafer with three-dimensional stacking structure | Electricity | 0 | Active |
| US10313620B2 | Image data output device for image signal processor | Electricity | 0 | Active |
| US9543348B2 | Backlight image sensor chip having improved chip driving performance | Electricity | 0 | Active |
| US7247533B2 | Method of fabricating semiconductor device using selective epitaxial growth | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.