System and method of silicon switched power delivery using a package
US8193630B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2011 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Jan 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first package-substrate connection, a second package-substrate connection, and metallization coupling the first package-substrate connection to the second package-substrate connection. The substrate is coupled to the package via the first package-substrate connection and the second package-substrate connection. The substrate includes a plurality of power domains and a power control unit. The second package-substrate connection of the package is coupled to a particular power domain of the plurality of power domains. The power control unit includes logic and a switch, where the switch includes a first terminal coupled to a voltage supply terminal, a control terminal coupled to the logic, and a second terminal coupled to the first package-substrate connection of the package. The logic selectively activates the switch to distribute power to the particular power domain via the metallization of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.