Inventor · Dripping Springs, TX, US

Thomas R. Toms

24Patents
8h-index
39Co-inventors
75Inventor score

Filing activity: Mar 4, 1991 → Oct 17, 2013

Most-cited inventions

PatentTitleAreaCited byStatus
US5263168A Circuitry for automatically entering and terminating an initialization mode in a data processing system in response to a control signal Physics 79 Expired
US5339279A Block erasable flash EEPROM apparatus and method thereof Physics 51 Expired
US6133759A Decoupled reset dynamic logic circuit Electricity 21 Expired
US5168466A Bias current generator circuit for a sense amplifier Physics 12 Expired
US6076177A Method and apparatus for testing a circuit module concurrently with a non-volatile memory operation in a multi-module data processing system Physics 12 Expired
US8143952B2 Three dimensional inductor and transformer Electricity 10 Active
US6240493A Method and apparatus for performing access censorship in a data processing system Physics 9 Expired
US7902654B2 System and method of silicon switched power delivery using a package Electricity 8 Active
US6499092B1 Method and apparatus for performing access censorship in a data processing system Physics 8 Expired
US7812582B2 System and method of power distribution control of an integrated circuit Emerging Cross-Sectional Technologies 8 Active
US8067816B2 Techniques for placement of active and passive devices within a chip Electricity 6 Active
US8598700B2 Active thermal control for stacked IC devices Electricity 5 Active
US8350358B2 Techniques for placement of active and passive devices within a chip Electricity 5 Active
US7904770B2 Testing circuit split between tiers of through silicon stacking chips Electricity 5 Active
US5631853A Flexible configuration of timebases in a timer system Physics 5 Expired
US8324066B2 Techniques for placement of active and passive devices within a chip Electricity 3 Active
US8508301B2 Three dimensional inductor, transformer and radio frequency amplifier Electricity 3 Active
US8987062B2 Active thermal control for stacked IC devices Electricity 2 Active
US8796073B2 Low cost die-to-wafer alignment/bond for 3d IC stacking Electricity 2 Active
US8184414B2 Method and apparatus for forming I/O clusters in integrated circuits Emerging Cross-Sectional Technologies 0 Active
US6008677A Voltage recovery circuit and method therefor Physics 0 Expired
US9014749B2 System and method to initiate a housekeeping operation at a mobile device Physics 0 Active
US8471582B2 Circuit for detecting tier-to-tier couplings in stacked integrated circuit devices Electricity 0 Active
US8193630B2 System and method of silicon switched power delivery using a package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.