Semiconductor wafer handling and transport
US8197177B2 · kind B2 · utility
26Cited by
53References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2008 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Jan 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.