Patent · US Active

Methods of forming sputtering targets

US8197894B2 · kind B2 · utility

19Cited by

107References

15Claims

0Family size

Assignee

H.C. STARCK INC. · US

Inventors

Steven A. Miller · Pinellas Park, US
Olaf Schmidt-Park · Krefeld, DE
Prabhat Kumar · Framingham, US
Richard Wu · North Chelmsford, US
Shuwei Sun · Framingham, US
Stefan Zimmermann · Laufenbürg, DE

Key dates

Filing date	Nov 8, 2007
Grant date	Jun 12, 2012
Priority date	—
Expiry date	Mar 28, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/332
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

In various embodiments, sputter-target formation includes application of a layer having an intermediate coefficient of thermal expansion between the backing plate and the target material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.