Printed wiring board
US8198546B2 · kind B2 · utility
5Cited by
37References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2007 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Jul 2, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the surface of the solder-resist layer, and forming multiple openings in the surface of the solder-resist layer to expose multiple portions of the conductive circuit so as to form multiple conductive pads for mounting an electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.