Printed circuit board and method of manufacturing the same
US8198550B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2009 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Jul 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The manufacturing process includes a step of pressing the circuit layer and the insulating material into the insulating layer to form a level surface while leaving the connection pads flush at the surface. The method makes the printed circuit board slim, and increases reliability and the degree of design freedom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.