Patent · US Active

Housing for micro-mechanical and micro-optical components used in mobile applications

US8201452B2 · kind B2 · utility

13Cited by

5References

13Claims

0Family size

Assignee

Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

Marten Oldsen · Kleve, DE
Ulrich Hofmann · Itzehoe, DE

Key dates

Filing date	Jan 17, 2008
Grant date	Jun 19, 2012
Priority date	—
Expiry date	Feb 16, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49826
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

The present invention relates to a housing for one or more micromechanical and/or micro-optic components, wherein the housing exhibits a supporting substrate having at least one micromechanical and/or micro-optic component and at least one cap substrate, which is joined to the supporting substrate. The supporting substrate and the at least one cap substrate form at least one cavity, which at least partially encloses the at least one micromechanical and/or micro-optic component, wherein the side of at least one cap substrate facing the at least one micromechanical and/or micro-optic component exhibits at least one optical window and at least one mechanical stop.Furthermore, the object of the present invention is a method for producing such a housing, wherein the method is particularly usable for encapsulation at the wafer level.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.