Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8204296B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2010 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | Nov 3, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.