Physical failure analysis guiding methods
US8205173B2 · kind B2 · utility
6Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2010 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | Oct 23, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2894
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method includes providing a plurality of failure dies, and performing a chip probing on the plurality of failure dies to generate a data log comprising electrical characteristics of the plurality of failure dies. An automatic net tracing is performed to trace failure candidate nodes in the failure dies. A failure layer analysis is performed on results obtained from the automatic net tracing. Physical failure analysis (PFA) samples are selected from the plurality of failure dies using results obtained in the step of performing the failure layer analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.