Manufacturing method of printed circuit board having electro component
US8206530B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Jan 15, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a printed circuit board having an electro component is disclosed. The method in accordance with an embodiment of the present invention includes: seating an electro component, in which an electrode is formed on an upper side, on an upper side of a bonding sheet; seating an insulator, in which a cavity corresponding to the electro component has been formed, on the upper side of the bonding sheet; laminating a first insulating resin on an upper side of the insulator such that an upper side of the electro component is covered; polishing the first insulating resin such that the electrode is exposed; and forming a first circuit pattern, which is electrically connected to the exposed electrode, on the polished first insulating resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.