Hyo-Bin Park
3Patents
2h-index
8Co-inventors
33Inventor score
Filing activity: Jan 9, 2009 → May 26, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9040838B2 | Method for forming solder resist and substrate for package | Electricity | 5 | Active |
| US10553452B2 | Printed circuit board, method, and semiconductor package | Electricity | 2 | Active |
| US8206530B2 | Manufacturing method of printed circuit board having electro component | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.