Method for producing nMOS and pMOS devices in CMOS processing
US8207030B2 · kind B2 · utility
3Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2009 |
| Grant date | Jun 26, 2012 |
| Priority date | — |
| Expiry date | Apr 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing one or more nMOSFET devices and one or more pMOSFET devices on the same semiconductor substrate is disclosed. In one aspect, the method relates to the use of a single activation anneal that serves for both Si nMOS and Ge pMOS. By use of a solid phase epitaxial regrowth (SPER) process for the Si nMOS, the thermal budget for the Si nMOS can be lowered to be compatible with Ge pMOS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.