Adhesive film composition, associated dicing die bonding film, die package, and associated methods
US8211540B2 · kind B2 · utility
2Cited by
2References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2008 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Jan 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.