Chang Beom Chung
4Patents
2h-index
13Co-inventors
34Inventor score
Filing activity: Jul 19, 2007 → Sep 14, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8309219B2 | Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same | Emerging Cross-Sectional Technologies | 5 | Active |
| US8211540B2 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | Emerging Cross-Sectional Technologies | 2 | Active |
| US8394493B2 | Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US8193259B2 | UV-curable pressure-sensitive adhesive composition with a fluorinated acrylic binder resin and pressure-sensitive adhesive film using the same | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.