Method and structure for bonding flip chip
US8211745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2010 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Aug 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.