Method of testing using a temporary chip attach carrier
US8213184B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 21, 2008 |
| Grant date | Jul 3, 2012 |
| Priority date | — |
| Expiry date | Feb 3, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49819
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing integrated circuit chips. The method includes: attaching integrated circuit chips to an interposer of a temporary carrier, the carrier comprising: a substrate, a first interconnects on a bottom surface and a second array of interconnects on a top surface of the substrate, corresponding first and second interconnects electrically connected by wires in the substrate; the interposer, first pads on a top surface and a second pads on a bottom surface of the interposer, corresponding first and second pads electrically connected by wires in the interposer, and the second pads in physical and electrical contact with corresponding second interconnects; and the interposer including an interposer substrate comprising a same material as a substrate of the integrated circuit chip; connecting interconnects of the first array of interconnects to a tester; and testing the one or more integrated circuit chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.