Patent · US Active

Method for producing a housing part for a semiconductor module

US8215008B2 · kind B2 · utility

0Cited by

6References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Olaf Kirsch · Erwitte, DE
Thilo Stolze · Arnsberg, DE

Key dates

Filing date	Jan 14, 2011
Grant date	Jul 10, 2012
Priority date	—
Expiry date	Mar 17, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing a housing part for a power semiconductor module includes providing a connecting lug having a lower end with a foot region, providing a housing having a side wall with a lead-in bevel, and inserting the connecting lug into the lead-in bevel so that the foot region projects inward into an interior of the housing. The method further includes encapsulating at least a portion of the foot region of the connecting lug inserted into the lead-in bevel with a first plastic to produce a positively locking first connection between the connecting lug and the side wall.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.