Method of analyzing thermal stress according to filling factor of filler in resin
US8215829B2 · kind B2 · utility
1Cited by
4References
10Claims
0Family size
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Key dates
| Filing date | Oct 22, 2009 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Dec 20, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0214
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.