Hidehiro Takeshima
8Patents
3h-index
11Co-inventors
50Inventor score
Filing activity: Aug 28, 2001 → Jul 2, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7808093B2 | Stacked semiconductor device | Electricity | 111 | Active |
| US8253258B2 | Semiconductor device with hollow and throughhole and method of manufacturing same | Electricity | 10 | Active |
| US6670220B2 | Semiconductor device and manufacture method of that | Electricity | 7 | Expired |
| US8247896B2 | Stacked semiconductor device and fabrication method for same | Electricity | 2 | Active |
| US8215829B2 | Method of analyzing thermal stress according to filling factor of filler in resin | Physics | 1 | Active |
| US8648455B2 | Semiconductor device and method of manufacturing the same | Electricity | 1 | Active |
| US7935576B2 | Semiconductor device and manufacturing method of the same | Electricity | 0 | Active |
| US9252125B2 | Stacked semiconductor device and fabrication method for same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.