Multi-chip module with multi-level interposer
US8218334B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2010 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Jul 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49947
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.