Inventor · San Diego, CA, US

Ivan Shubin

35Patents
10h-index
27Co-inventors
67Inventor score

Filing activity: Feb 20, 2009 → Feb 6, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US8742576B2 Maintaining alignment in a multi-chip module using a compressible structure Electricity 63 Active
US9297971B2 Hybrid-integrated photonic chip package with an interposer Electricity 35 Active
US8548287B2 Direct interlayer optical coupler Emerging Cross-Sectional Technologies 27 Active
US8390109B2 Chip package with plank stack of semiconductor dies Electricity 20 Active
US9698564B1 Hybrid integrated MCM with waveguide-fiber connector Electricity 20 Active
US9142698B1 Integrated electro-absorption modulator Emerging Cross-Sectional Technologies 17 Active
US9250403B2 Hybrid-integrated photonic chip package with an interposer Electricity 15 Active
US8014636B2 Electrical contacts on top of waveguide structures for efficient optical modulation in silicon photonic devices Emerging Cross-Sectional Technologies 14 Active
US9696486B2 Surface-normal coupler for silicon-on-insulator platforms Physics 12 Active
US9829626B2 Hybrid-integrated multi-chip module Physics 11 Active
US8772920B2 Interconnection and assembly of three-dimensional chip packages Electricity 10 Active
US9411177B2 Integrated electro-absorption modulator Emerging Cross-Sectional Technologies 10 Active
US9470855B1 Self-assembled vertically aligned multi-chip module Physics 10 Active
US7848599B2 Optical device with large thermal impedance Emerging Cross-Sectional Technologies 9 Active
US8982563B2 Chip package to support high-frequency processors Electricity 8 Active
US8428404B1 Optical device on inverted, substrateless chip Physics 8 Active
US8218334B2 Multi-chip module with multi-level interposer Emerging Cross-Sectional Technologies 7 Active
US8988770B2 Hybrid optical source with semiconductor reflector Electricity 6 Active
US8150223B2 Thermal tuning of an optical device Physics 6 Active
US8078013B2 Dual-layer thermally tuned optical device Physics 5 Active
US8131119B2 Optical device with large thermal impedance Emerging Cross-Sectional Technologies 4 Active
US9519105B1 Self-assembled vertically aligned multi-chip module Physics 3 Active
US9488777B2 Back-side etching and cleaving of substrates Electricity 2 Active
US9281268B2 Method for fabricating multi-chip module with multi-level interposer Emerging Cross-Sectional Technologies 2 Active
US9871346B1 Mode-hop-free hybrid external-cavity laser with passive thermo-optic coefficient compensation Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.