Budgeting electromigration-related reliability among metal paths in the design of a circuit
US8219953B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2009 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Dec 29, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/367
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Apportioning unequally contributions of different metal paths of a circuit to electromigration (EM) reliability. In an embodiment, a corresponding parameter value representing a magnitude of excess current flowing in a single direction in each metal path is determined. A desired reliability measure for electromigration (EM) is apportioned among the metal paths based on computed parameter values for the corresponding metal path. A reliability analysis for the circuit is performed based on the apportioning. In an embodiment, metal paths which predominantly carry currents with an average value less than a threshold are excluded from being considered as contributors to EM degradation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.