Cleaning of bonded silicon electrodes
US8221552B2 · kind B2 · utility
3Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2007 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | May 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32862
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods of cleaning plasma processing chamber components include contacting surfaces of the components with a cleaning solution, while avoiding damage of other surfaces or areas of the components by the cleaning solution. An exemplary plasma processing chamber component to be cleaning is an elastomer bonded electrode assembly having a silicon member with a plasma-exposed silicon surface, a backing member, and an elastomer bonding material between the silicon surface and the backing member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.