Noble metal barrier layers
US8222746B2 · kind B2 · utility
4Cited by
14References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2006 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Feb 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53238
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Noble metal barrier layers are disclosed. In one aspect, an apparatus may include a substrate, a dielectric layer over the substrate, and an interconnect structure within the dielectric layer. The interconnect structure may have a bulk metal and a barrier layer. The barrier layer may be disposed between the bulk metal and the dielectric layer. The barrier layer may include one or more metals selected from iridium, platinum, palladium, rhodium, osmium, gold, silver, rhenium, ruthenium, tungsten, and nickel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.